Wafer clamp and a method of clamping a wafer

ABSTRACT

A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 15/454,978, filed on Mar. 9, 2017, the entire contents of which arehereby expressly incorporated by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention generally relates to a wafer clamp, and moreparticularly to a wafer clamp adaptable to a robot system for pickingand placing a wafer.

2. Description of Related Art

A robotic hand (or fork) of a robot system is commonly utilized forpicking and placing a wafer (or chip) automatically. A vacuum fork isconventionally used to hold a wafer. Owing to misalignment usuallyoccurred in the conventional vacuum fork, the wafer cannot be preciselypositioned and picked, therefore falling and breaking.

Moreover, the conventional vacuum fork is designed to make physicalcontact with the top or bottom surface of a wafer to be picked. Thistype of equipment is not adaptable to a wafer such as an opticalcomponent (e.g., an optical lens or glass).

An engaged type fork is provided to overcome disadvantages of the vacuumfork. However, conventional engaged type forks are incapable of fastmoving or rotating without being flipped over the wafer.

For the reasons that conventional robotic forks could not effectivelyposition and pick the wafer, a need has thus arisen to propose a novelwafer clamp to overcome the disadvantages of the conventional roboticforks.

SUMMARY OF THE INVENTION

In view of the foregoing, it is an object of the embodiment of thepresent invention to provide a wafer clamp adaptable to a robot systemand a method of clamping a wafer. The provided wafer clamp is capable ofprecisely positioning a wafer, and is capable of fast moving androtating without flipping over the wafer.

According to one embodiment, a wafer clamp includes a platform, astopper, a push rod, at least one actuator, and a sensor. The platformhas a top surface. The stopper is disposed at a front end of theplatform, and the push rod is disposed at a rear end of the platform.The actuator is pivotally connected to the push rod. The sensor isdisposed at the front end of the platform to measure a distance betweenthe sensor and a wafer over the sensor.

According another embodiment, a method of clamping a wafer is disclosed.A wafer clamp is moved forward into a slot with the wafer. A sensordetects presence of the wafer over the sensor. The wafer clamp iscontinuously moved forward until the sensor detects absence of thewafer. The wafer clamp is moved upward and at least one actuator isactuated to move a push rod forward such that the wafer is held tightlybetween a stopper and the push rod.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a perspective view of a wafer clamp adaptable to a robotsystem according to one embodiment of the present invention;

FIG. 1B shows a perspective view of an exemplary pneumatic cylinderaccording to one embodiment of the present invention;

FIG. 1C shows a perspective view of an exemplary fiber optic sensoraccording to one embodiment of the present invention;

FIG. 2 schematically shows a top view of the wafer clamp of FIG. 1A;

FIG. 3A to FIG. 3D schematically demonstrate a process flow performed bythe wafer clamp of FIG. 1A to pick a wafer; and

FIG. 4 shows a perspective view of FIG. 3D.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1A shows a perspective view of a wafer clamp 100 adaptable to arobot system according to one embodiment of the present invention. FIG.2 schematically shows a top view of the wafer clamp 100 of FIG. 1A. Thewafer clamp 100 of the embodiment is capable of temporarily holding awafer 10 in a fixed position to prevent movement or separation. Thewafer clamp 100 is particularly, but not limitedly, adaptable to hold awafer without making physical contact with the top or bottom surface ofthe wafer. The term robotic fork is used instead when the wafer clamp100 is used as a robotic hand for picking and placing a wafer 10, suchas an optical lens or glass, in conjunction with other components of arobot system.

In the embodiment, the wafer clamp 100 may include a platform 11 with asubstantially flat top surface. The platform 11 is configured to supportthe wafer 10 by being beneath the wafer and holding it up.

The wafer clamp 100 of the embodiment may include a stopper 12 disposedat a front end of the platform 11. In the embodiment, the stopper 12 isfixed to the platform 11, and a top surface of the stopper 12 is at alevel higher than the top surface of the platform 11. Accordingly, whenthe wafer 10 rests on the platform 11, the top surface of the stopper 12is preferably at a level equal to or higher than a top surface of thewafer 10. It is appreciated that, in one embodiment, the stopper 12 maybe integrally manufactured with the platform 11. In another embodiment,the stopper 12 and the platform 11 may be individually manufactured,then being fixed together, for example, by adhesive.

The wafer clamp 100 of the embodiment may include a push rod 13 disposedat a rear end of the platform 11. In the embodiment, the push rod 13 ismovable with respect to the rear end of the platform 11, and a topsurface of the push rod 13 is at a level higher than the top surface ofthe platform 11. Accordingly, when the wafer 10 rests on the platform11, the top surface of the push rod 13 is preferably at a level equal toor higher than a top surface of the wafer 10.

The wafer clamp 100 of the embodiment may also include at least oneactuator 14 that is pivotally connected to the push rod 13.Specifically, the actuator 14 is configured to move the push rod 13forward (i.e., toward the front end of the platform 11), such that thewafer 10 may be held tightly between the stopper 12 and the push rod 13.In the embodiment shown in FIG. 1A, two actuators 14 being parallel witheach other are pivotally connected to the push rod 13. In anotherembodiment, one actuator 14 and at least one auxiliary rod (not shown)being parallel with each other are pivotally connected to the push rod13.

In the embodiment, the actuator 14 preferably includes a pneumaticcylinder (also known as an air cylinder), which is a mechanical devicethat uses the power of compressed gas to produce a force in areciprocating linear motion. The pneumatic cylinder is preferred becauseof being quieter, cleaner and requiring less amounts of space. FIG. 1Bshows a perspective view of an exemplary pneumatic cylinder 14 accordingto one embodiment of the present invention. A pneumatic cylinder with amodel name CJ1 manufactured by Steven Engineering, Inc., California may,but not necessarily, be adopted in the embodiment. Although thepneumatic cylinder is adopted in the embodiment, it is appreciated thatother mechanical devices may be used instead.

In the embodiment, the pneumatic cylinder 14 may have a spring returnfeature, indicating that a front end of the pneumatic cylinder 14 willpull back to an original position by an interior spring (not shown) whenthe pneumatic cylinder 14 is not actuated. Accordingly, the push rod 13will be pulled backward (i.e., away from the front end of the platform11), thereby releasing the wafer 10. In another embodiment, thepneumatic cylinder 14 has no spring return feature, and the push rod 13may be pulled backward by an exterior spring (not shown) that exerts aforce on the push rod 13 in a direction away from the front end of theplatform 11. The pneumatic cylinder 14 may be supported by a plate 15.In one embodiment, the plate 15 with the pneumatic cylinder 14 ismanufactured and provided as a module, which may be fixed to other partof the wafer clamp 100, for example, by screwing via mounting holes 17.

The wafer clamp 100 of the embodiment may further include a sensor 16disposed at the stopper 12 or the front end of the platform 11. Thesensor 16 is positioned to face upward and is configured to measure adistance between the sensor 16 and an object (the wafer 10 in this case)over the sensor 16. A control signal transmitted to the sensor 16 and asense signal received from the sensor 16 may be transferred between thesensor 16 and a controller (not shown), which may also control theactuator 14.

In the embodiment, the sensor 16 preferably includes a fiber opticsensor (e.g., reflective fiber optic sensor), which is a sensor thatmeasures the distance by modifying a fiber so that the quantity to bemeasured modulates the intensity, phase, polarization, wavelength ortransit time of light in the fiber. The fiber optic sensor is preferredbecause of its small size, immune to electromagnetic interference,resistance to high voltage electricity and temperature. FIG. 1C shows aperspective view of an exemplary fiber optic sensor according to oneembodiment of the present invention. A fiber optic sensor with a modelname FU manufactured by Keyence Corporation, Taiwan may, but notnecessarily, be adopted in the embodiment. In one embodiment, the fiberoptic sensor is manufactured and provided as a module, which may befixed to other part of the wafer clamp 100, for example, by screwing viamounting holes 18. Although the fiber optic sensor is adopted in theembodiment, it is appreciated that other sensors may be used instead.

FIG. 3A to FIG. 3D schematically demonstrate a process flow performed bythe wafer clamp 100 of FIG. 1A to pick a wafer 10, for example, from acassette 31. At first, in FIG. 3A, the wafer clamp 100, acting as arobotic hand of a robot system, moves into a slot of the cassette 31. Atthis stage, the actuator 14 is not actuated, and the push rod 13 is thusin a backward position (i.e., original position). The sensor 16 detectsthe presence of the wafer according to a measured first distance d1between the sensor 16 and the wafer 10 over the sensor 16. In oneembodiment, the presence of the wafer 10 is detected while the sensor 16receives a light signal reflecting back from the wafer 10.

The wafer clamp 100 continues moving forward until the sensor 16 detectsthe absence of the wafer 10 according to a measured second distance d2that is greater than the first distance d1 as shown in FIG. 3B. In oneembodiment, the absence of the wafer 10 is detected while the sensor 16receives no light signal reflecting back from the wafer 10.

As shown in FIG. 3C, upon detecting the absence of the wafer 10, thewafer clamp 100 moves upward and the actuator 14 is actuated to move thepush rod 13 forward (i.e., toward the front end of the platform 11),such that the wafer 10 may be held tightly between the stopper 12 andthe push rod 13. Finally, as shown in FIG. 3D, the wafer clamp 100 liftsthe wafer 10 away from the cassette 31. A perspective view of FIG. 3D isshown in FIG. 4.

According to the embodiments disclosed above, compared with a vacuumfork, the present invention provides a wafer clamp 100 that is capableof precisely positioning a wafer 10 by using a sensor 16, particularly afiber optic sensor. The present invention also provides a wafer clamp100 that is capable of fast moving and rotating without flipping overthe wafer 10 by using an actuator 14, particularly a pneumatic cylinder.

Although specific embodiments have been illustrated and described, itwill be appreciated by those skilled in the art that variousmodifications may be made without departing from the scope of thepresent invention, which is intended to be limited solely by theappended claims.

What is claimed is:
 1. A method of clamping a wafer, comprising:providing a wafer clamp; moving the wafer clamp forward into a slot withthe wafer; a sensor detecting presence of the wafer over the sensor;continuously moving the wafer clamp forward until the sensor detectsabsence of the wafer; and moving the wafer clamp upward and actuating atleast one actuator to move a push rod forward such that the wafer isheld tightly between a stopper and the push rod.
 2. The method of claim1, wherein the wafer clamp comprises: a platform; the stopper disposedat a front end of the platform; the push rod disposed at a rear end ofthe platform; said at least one actuator pivotally connected to the pushrod; and the sensor disposed at the front end of the platform
 3. Themethod of claim 1, wherein the actuator comprises a pneumatic cylinder.4. The method of claim 3, wherein a front end of the pneumatic cylinderpulls back to an original position when the pneumatic cylinder is notactuated.
 5. The method of claim 1, wherein the sensor comprises areflective fiber optic sensor.
 6. The method of claim 5, wherein thepresence of the wafer is detected while the reflective fiber opticsensor receives a light signal reflecting back from the wafer.
 7. Themethod of claim 5, wherein the absence of the wafer is detected whilethe reflective fiber optic sensor receives no light signal reflectingback from the wafer.